Wearable device with combined sensing capabilities

ABSTRACT

The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user&#39;s body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.

CROSS REFERENCE

The present invention is a Division of Ser. No. 14/726,472 filed May 30,2015. The present invention claims priority to TW 104108897, filed onMar. 20, 2015.

BACKGROUND OF THE INVENTION Field of Invention

The present invention relates to a wearable device; particularly, itrelates to a wearable device with combined sensing capabilities, inwhich an infrared temperature sensor is integrated.

Description of Related Art

U.S. Patent Publication No. 2011/0265706 discloses a wearable device formeasuring an ambient environmental temperature or a surface temperatureof an object. There are other prior arts disclosing a wearable devicesfor sensing blood pressure or heart rate. For reference, U.S. Pat. Nos.8,140,143 and 5,430,692 are pertinent prior arts.

These prior arts, nevertheless, are only capable of performing onesingle sensing function, not multiple sensing functions. For example,there is no prior art integrating a heart rate sensing function, atemperature sensing function, a blood pressure meter and the relevantsensing circuits. None of these prior arts can sense, for example, bothheart rate and temperature.

In view of the above, to overcome the drawbacks in the prior arts, thepresent invention proposes a wearable device with combined sensingcapabilities, in which an infrared temperature sensor is integrated.

SUMMARY OF THE INVENTION

From one perspective, the present invention provides a wearable devicewith combined sensing capabilities, comprising: a wearable assembly forbeing worn on a part of a user's body, wherein the wearable assembly hasat least one light-transmissible window; and at least one multi-functionsensor module located inside the wearable assembly, for performing animage sensing function and an infrared temperature sensing function, themulti-function sensor module including: an image sensor module forsensing a physical or a biological feature of an object through the atleast one light-transmissible window by way of image sensing; and aninfrared temperature sensor module for sensing temperature through theat least one light-transmissible window by way of infrared temperaturesensing.

In one embodiment, the image sensor module is for sensing heart rate,blood oxygen concentration, blood pressure or breathing rate.

In one embodiment, the multi-function sensor module further includes asubstrate, a cap and at least one partitioning member, the cap coveringa part of the substrate and the at least one partitioning member beingon the substrate, to form at least two chambers for accommodating theimage sensor module and the infrared temperature sensor module,respectively, wherein each of the at least two chambers has alight-transmissible zone, and a light beam is allowed to transmitbetween the light-transmissible zone and the light-transmissible windowof the wearable assembly.

In one embodiment, the image sensor module includes a light source andan image sensor, the cap covering a part of the substrate and the atleast one partitioning member being on the substrate, to form at leastthree chambers for accommodating the light source, the image sensor andthe infrared temperature sensor module, respectively, wherein each ofthe at least three chambers has a light-transmissible zone, and a lightbeam is allowed to transmit between the light-transmissible zone and thelight-transmissible window of the wearable assembly.

In one embodiment, the image sensor module includes a light source andan image sensor, the image sensor and the infrared temperature sensormodule being integrated as one single module.

In one embodiment, the multi-function sensor module further includes asubstrate, a cap covering a part of the substrate and at least onepartitioning member, the cap and the at least one partitioning memberbeing on the substrate, to form at least two chambers for accommodatingthe light source and the single module, respectively, wherein each ofthe at least two chambers has a light-transmissible zone, and a lightbeam is allowed to transmit between the light-transmissible zone and thelight-transmissible window of the wearable assembly.

In one embodiment, the light source, the image sensor and the infraredtemperature sensor module are not covered with a filler material.

In one embodiment, each of the light source and the image sensor isfully covered with or at least partially covered with a correspondingfiller material, while the infrared temperature sensor module is notcovered with a filler material.

In one embodiment, the light source, each of the light source, the imagesensor and the infrared temperature sensor module is fully covered withor at least partially covered with a corresponding filler material.

In one embodiment, the light-transmissible zone corresponding to theinfrared temperature sensor module is sealed entirely or partially witha light filtering material.

In one embodiment, a protection cap layer is connected above theinfrared temperature sensor module, wherein a space between theprotection cap layer and the infrared temperature sensor module is notfilled with any filler material.

In one embodiment, a protection ring is provided between the infraredtemperature sensor module and the light-transmissible zone correspondingto the infrared temperature sensor module, the protection ringsurrounding a lateral periphery of a space between the infraredtemperature sensor module and the corresponding light-transmissiblezone.

In one embodiment, the multi-function sensor module further includes amicro-electro-mechanical systems (MEMS) device for providing one of thefollowing functions: a sweat sensor, an ultraviolet light sensor, a gassensor, an accelerometer, a gyroscope, an altimeter or a pedometer.

In one embodiment, the light-transmissible window is at an uppersurface, a lower surface or a lateral surface of the wearable assembly.

In one embodiment, the wearable assembly has a light-transmissiblewindow at an upper surface of the wearable assembly and anotherlight-transmissible window at a lower surface of the wearable assembly,and the multi-function sensor module further includes a contact typetemperature sensor, for sensing temperature through the twolight-transmissible windows at the upper surface and the lower surfaceof the wearable assembly.

In one embodiment, the multi-function sensor module includes atemperature contact point located at the lower surface, for directlycontacting the object, the temperature contact point being coupled tothe contact type temperature sensor.

In one embodiment, the wearable assembly has a light-transmissiblewindow at an upper surface of the wearable assembly and anotherlight-transmissible window at a lower surface of the wearable assembly,and the infrared temperature sensor module senses temperature throughthe two light-transmissible windows at the upper surface and the lowersurface.

In one embodiment, the multi-function sensor module includes atemperature contact point located at the lower surface, for directlycontacting the object, the temperature contact point being coupled tothe infrared temperature sensor module via a signal transmissionstructure.

In one embodiment, the infrared temperature sensor module includes aninfrared sensor, a temperature sensing switch and a thermopile circuit,wherein when the temperature sensing switch receives a temperaturesignal higher than a predetermined threshold through the infraredsensor, the thermopile circuit is enabled to perform a real timetemperature sensing function; and when the thermopile circuit is notenabled, the thermopile circuit is in a stand-by mode for saving power.

The objectives, technical details, features, and effects of the presentinvention will be better understood with regard to the detaileddescription of the embodiments below, with reference to the attacheddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1C are schematic views, showing several embodiments as to how amulti-function sensor module is provided inside a wearable assembly.

FIGS. 2A-2C are side views, showing several embodiments as to how amulti-function sensor module is provided inside a wearable assembly.

FIG. 3 shows a top view of a multi-function sensor module according toan embodiment of the present invention.

FIG. 4 shows a block diagram as to how the present invention performs areal time temperature sensing function.

FIGS. 5A-5C show several embodiments of the multi-function sensor moduleof the present invention.

FIGS. 6A-6D show several other embodiments of the multi-function sensormodule of the present invention.

FIGS. 7A-7B show several further other embodiments of the multi-functionsensor module of the present invention.

FIG. 8 shows a top view of a multi-function sensor module according toanother embodiment of the present invention.

FIGS. 9A-9C show several further other embodiments of the multi-functionsensor module of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The above and other technical details, features and effects of thepresent invention will be will be better understood with regard to thedetailed description of the embodiments below, with reference to thedrawings. The drawings as referred to throughout the description of thepresent invention are for illustration only, to show the interrelationsbetween the apparatus and devices, but not drawn according to actualscale.

Please refer to FIGS. 1A-1C and FIGS. 2A-2C. FIGS. 1A-1C are schematicviews, showing several embodiments as to how a multi-function sensormodule is provided inside a wearable assembly. FIGS. 2A-2C are sideviews, showing several embodiments as to how a multi-function sensormodule is provided inside a wearable assembly. As shown in FIG. 2A, awearable device 100 with combined sensing capabilities includes awearable assembly 33 and a multi-function sensor module 20 integratedinside the wearable assembly 33.

The wearable assembly 33 can be worn on a part of a user's body. In oneembodiment, the wearable assembly 33 can be, for example but not limitedto, a watch (which includes a watch body and watch strap). In otherembodiments, the wearable assembly 33 can be any type of wearableproduct, or a belt or a metal chain for wearing.

The wearable assembly 33 has at least one light-transmissible window 21,which corresponds to one or more light-transmissible zones of themulti-function sensor module 20 (the term “corresponds to” as used inthe above sentence is meant to indicate that a light beam passingthrough the light-transmissible window 21 can be transmitted to the oneor more light-transmissible zones of the multi-function sensor module20; however, there can be a distance between the light-transmissiblewindow 21 and the one or more light-transmissible zones). FIG. 2A is aside view according to FIG. 1C. As shown in FIG. 1C and FIG. 2A, thelight-transmissible window 21 is at an upper surface 331 of the wearableassembly 33. Thus, when an object 15 (for example but not limited to afinger or a wrist) is near the light-transmissible window 21 at theupper surface 331 of the wearable assembly 33, the multi-function sensormodule 20 can sense the temperature of the finger or the wrist, forexample in a non-contact manner. Certainly, the user also can put hisfinger, wrist or any other part to be sensed directly on and in contactwith the light-transmissible window 21. (The structure and features asto how the multi-function sensor module 20 senses temperature will bedescribed later.) In this embodiment, the multi-function sensor module20 can further have, in addition to temperature sensing function,multiple other physical or biological feature sensing functions such asheart rate sensing function, blood pressure sensing function and/orblood oxygen concentration sensing function (to be described in detaillater).

In this embodiment, because the multi-function sensor module 20 islocated beneath the light-transmissible window 21 at the upper surface331 of the wearable assembly 33, a user wearing the wearable device 100with combined sensing capabilities can measure his or her foreheadtemperature by approaching his or her wrist near his or her forehead, orby approaching his or her body part to be measured near thelight-transmissible window 21. In addition to measuring the user's owntemperature, the wearable device 100 can also be used to measure theforehead (or other) temperature of any surrounding people, which doesnot require taking off the wearable assembly 33 from the user.

According to the present invention, the light-transmissible window 21 ofthe wearable assembly 33 can be located at, instead of or in addition tothe upper surface 331 of the wearable assembly 33, a lower surface 332of the wearable assembly 33 (as shown in FIG. 1A and FIG. 2C) and/or alateral surface 333 of the wearable assembly 33 (as shown in FIG. 1B).The wearable assembly 33 can include one or more light-transmissiblewindows 21 depending on practical needs. The number and the location(s)of the multi-function sensor module 20 can be correspondingly arrangedaccording to the number and the location(s) of the light-transmissiblewindow 21.

FIG. 2C is a side view according to FIG. 1A. As shown in FIG. 1A andFIG. 2C, the light-transmissible window 21 is located at a lower surface332 of the wearable assembly 33. Thus, when the user wears the wearableassembly 33 (for example but not limited to a watch) on his or herwrist, the light-transmissible window 21 at the lower surface 332 of thewearable assembly 33 will be facing the object 15 (for example but notlimited to the skin of the wrist). As such, the multi-function sensormodule 20 can sense the temperature of the skin of the wrist, forexample by direct contact. In this embodiment, the wearable device 100with combined sensing capabilities can perform biological featuremonitoring functions such as physical strength evaluation duringexercise, body temperature recording, skin temperature monitoring(sun-burnt monitoring), abnormal temperature alarming and energyconsumption evaluation, etc. (The details as to how the multi-functionsensor module 20 senses temperature will be described later).

When the temperature or other physiological information is sensed bydirect contact, the light-transmissible window 21 of the wearableassembly 33 can be implemented as an aperture. On the other hand, whenthe temperature or other physiological information is sensed by anon-contact manner, the light-transmissible window 21 of the wearableassembly 33 can be implemented as an aperture or a window made of alight-transmissible material.

In one embodiment, the number of the multi-function sensor module 20 isnot limited to one, but can be plural as necessary. For example, asshown in FIG. 2B, the wearable device 100 with combined sensingcapabilities can include one wearable assembly 33 and two multi-functionsensor modules 20 integrated into the wearable assembly 33. Onelight-transmissible window 21 is provided at an upper surface 331 of thewearable assembly 33, corresponding to one of the two multi-functionsensor modules 20, while another light-transmissible window 21 isprovided at a lower surface 332 of the wearable assembly 33,corresponding to another one of the two multi-function sensor modules20. Thus, in the embodiment shown in FIG. 2B, both “non-contact typetemperature sensing” (through the light-transmissible window 21 at theupper surface 331) and “contact type temperature sensing” (through thelight-transmissible window 21 at the lower surface 332) are integratedinto one single wearable assembly 33.

In other embodiments, the number of the multi-function sensor module 20is not limited to two (as shown in FIG. 2B), but can be more asnecessary. In other words, two or more light-transmissible windows 21can be provided at the wearable assembly 33 at two or more of the uppersurface 331, the lower surface 332 and the lateral surface 333 of thewearable assembly 33 (i.e., any combination of two or more of FIGS. 1Ato 1C).

Please refer to FIG. 3 in conjugation with FIG. 5. FIG. 3 shows a topview of a multi-function sensor module according to an embodiment of thepresent invention. FIG. 5A shows a cross sectional view of themulti-function sensor module of the present invention. Themulti-function sensor module 20 at least includes: a chip or a modulefor sensing a physical or a biological feature of an object by way ofimage sensing (hereinafter referred to as “image sensor module”regardless whether it is a chip or a module) and a chip or a module forsensing temperature of the object by way of infrared temperature sensing(hereinafter referred to as “infrared temperature sensor module”regardless whether it is a chip or a module). Sensing a physical or abiological feature of an object by way of image sensing for example canbe, but not limited to, sensing heart rate, blood oxygen concentration,blood pressure, breathing rate, and so on. Sensing temperature of theobject by way of infrared temperature sensing for example can be, butnot limited to, sensing human body temperature. Or, in anotherembodiment, a thermal image of the object can be sensed by way ofinfrared temperature sensing. In addition, the multi-function sensormodule 20 can further include a chip or a module with another functionsuch as, but not limited to, a sweat sensor, an ultraviolet lightsensor, a gas sensor, an accelerometer, a gyroscope, an altimeter and/ora pedometer. The term “image sensor module” as described herein is meantto indicate a sensor module which generates information according tochanges between images (e.g., for generating information of heart rate,blood oxygen concentration, blood pressure and/or breathing rateaccording to changes between images). The term “infrared temperaturesensor module” as described herein is meant to indicate a sensor modulefor sensing temperature according to infrared information (for examplebut not limited to sensing body temperature).

In one embodiment, the image sensor module includes a light source andan image sensor. For better performance, it is preferred to isolate thelight source from the image sensor, so that a light beam emitted fromthe light source will only be reflected by the object but will not betransmitted to the image sensor directly. In this case, the light sourceand the image sensor can be disposed at two different chambers. Withrespect to the other chips or modules of the multi-function sensormodule 20, they can be disposed at another chamber or other chambers.Some of the chips or modules can share a same chamber as long as theirsignals will not interfere one another. In other words, according to thepresent invention, the multi-function sensor module 20 at least includesan image sensor module and an infrared temperature sensor module, whilethe number of the chambers can be determined depending on practicalneeds. The chambers can be entirely or partially compartmented.

FIG. 5A shows a cross sectional view of the multi-function sensor module20 of the present invention. As shown in FIG. 5A, in this embodiment,the multi-function sensor module 20 includes a substrate 28. A firstchamber A, a second chamber B, a third chamber C and a fourth chamber Dare formed on the substrate 28 through partitioning members 27 a, 27 b,and 27 c. A cap 26A is covered on the top and the peripheral sides ofthe chambers.

Still referring to FIG. 3 and FIG. 5A, the multi-function sensor module20 of this embodiment includes an infrared temperature sensor module 22and an image sensor module ISM. The image sensor module ISM includes alight source 24 and an image sensor 23. The light source 24 for examplecan be, but is not limited to, a light emitting diode device. The imagesensor 23 for example can be, but is not limited to, a heart ratesensor. The light emitting diode device provides a light beam (forexample but not limited to a visible light), which is reflected by anobject (e.g., a human body), and then transmitted to the heart ratesensor, for sensing the heart rate. The same approach can be adopted tosensing blood oxygen concentration, blood pressure and/or breathingrate. As a more specific example, if it is desired to sense heart rate,the light source 24 can be a green light source. The image sensor 23receives the light beam reflected by the object, and analyzes thereflected light beam to obtain the heart rate information. Certainly, tomeasure different biological features, the light source 24 and the imagesensor 23 can be arranged otherwise, to cooperate with each other. Theabove-mentioned embodiment is for illustrative purpose only, but not forlimiting the scope of the present invention.

The multi-function sensor module 20 can further include, in addition tothe infrared temperature sensor module 22, the image sensor module 23and the light source 24, a device for performing another function, suchas a Micro-electro-mechanical Systems (MEMS) device 25. The MEMS device25 can be, for example but not limited to, a sweat sensor, anultraviolet light sensor, a gas sensor, an accelerometer, a gyroscope,an altimeter or a pedometer. The infrared temperature sensor module 22,the image sensor module 23, the light source 24 and the MEMS device 25are accommodated into the above-mentioned first chamber A, secondchamber B, third chamber C and fourth chamber D, respectively. Note thatthe relative positions of the chambers are not limited to thearrangement shown in the figure, but can be arranged otherwise. If it isrequired to incorporate more than two MEMS devices 25, the number of thechambers can be increased. Also, if some of the modules do not need tobe isolated form one another, the number of the chambers can be reduced(e.g., referring to the embodiment shown in FIG. 9, which will bedescribed later). Besides, if the MEMS device 25 is a type of sensorsuch as an accelerometer, an ultraviolet light sensor, a gyroscope, analtimeter or a pedometer, it is not necessary to form an aperture at acorresponding position above the MEMS device 25. On the other hand, ifthe MEMS device 25 is a type of sensor such as a sweat sensor and a gassensor, it will be necessary to form an aperture at a correspondingposition above the MEMS device 25. FIGS. 5A-5C are for illustrativepurpose only, but not for limiting the scope of the present invention.

One of the features of the present invention is that: the wearabledevice 100 with combined sensing capabilities integrates heart ratesensing function and temperature sensing function in one device, so thatthe wearable device 100 is more convenient and friendly to a user, andthe volume as well as the manufacturing cost of the device is reduced.

In one embodiment, the infrared temperature sensor module 22 can be athermopile temperature sensor module, which is manufactured through astandard CMOS process. In one example, a thermopile temperature sensormodule includes P-type materials and N-type materials connected inseries, which generates a change in voltage in response to a change intemperature. Referring to FIG. 4 for a more specific embodiment, theinfrared temperature sensor module 22 can include an infrared sensor225, a temperature sensing switch 223 and a thermopile circuit 224. Whenthe temperature sensing switch 223 receives a temperature signal higherthan a predetermined threshold through the infrared sensor 225(regardless whether it senses temperature by the “contact type” shown inFIG. 1A or the “non-contact type” shown in FIG. 1C), the temperaturesensing switch 223 enables the thermopile circuit 224 to perform a realtime temperature sensing function; when the thermopile circuit 224 isnot enabled, the thermopile circuit 224 is in a stand-by mode to savepower.

In one embodiment, the infrared temperature sensor module 22 can sensetemperature in a “non-contact” manner. For example, when the user wearson the wearable assembly 33 (for example but not limited to a watch),the wearable assembly 33 can sense temperature in a non-contact manneras shown in FIG. 1C, and can simultaneously sense the user's heart rate.More specifically, the wavelength detected by the infrared temperaturesensor module 22 employing a thermopile is usually in a far infraredwavelength range. That is, temperature of an object can be sensed bydetecting the far infrared ray emitted from that object. Therefore, ifthe wavelengths to be detected by the infrared temperature sensor module22 and the image sensor 23 are different from each other, it is notnecessary to isolate them from each other.

In another embodiment, the infrared temperature sensor module 22 cansense temperature by way of direct contact. Under such circumstance,when the user wears the wearable assembly 33 (for example but notlimited to a watch) on his or her wrist, the wearable assembly 33 cansense temperature in a direct contact manner as shown in FIG. 1A, andcan simultaneously sense the user's heart rate.

Still referring to FIG. 5A, the multi-function sensor module 20 includesa first light-transmissible zone 21 a, a second light-transmissible zone21 b, a third light-transmissible zone 21 c and a fourthlight-transmissible zone 21 d. The first light-transmissible zone 21 acorresponds to the infrared temperature sensor module 22 in the firstchamber A; the second light-transmissible zone 21 b corresponds to theimage sensor 23 in the second chamber B; the third light-transmissiblezone 21 c corresponds to the light source 24 in the third chamber C; thefourth light-transmissible zone 21 d corresponds to the MEMS device 25in the fourth chamber D. The infrared temperature sensor module 22 iselectrically connected to a corresponding external circuit viaconduction wires 221 and 222. The image sensor 23 is electricallyconnected to a corresponding external circuit via conduction wires 231and 232. The light source 24 is electrically connected to acorresponding external circuit via conduction wires 241 and 242. TheMEMS device 25 is electrically connected to a corresponding externalcircuit via conduction wires 251 and 252. A light beam is allowed totransmit between each of the light-transmissible zones 21 a-21 d and thelight-transmissible window 21 (referring to FIGS. 2A-2C), respectively(i.e., a light beam can be transmitted between each light-transmissiblezone and the light-transmissible window 21, but preferably not betweentwo light-transmissible zones).

In one embodiment, in the multi-function sensor module 20 shown in FIG.5A, the first chamber A, the second chamber B and the third chamber Care not filled with any filler material, and the fourth chamber D isalso not filled with any filler material, as the multi-function sensormodule 20 is packaged.

In another embodiment, the fourth chamber D may not require the fourthlight-transmissible zone 21 d. Under such situation, in one embodiment,the cap 26A can be made of a transparent material. More specifically, onone hand, when it is required to transmit or receive light in a chamber,it is necessary for this chamber to have a light-transmissible zone oremploy a transparent material as its cap. For example, it is necessaryfor the chambers wherein the light source, the image sensor and theinfrared temperature sensor module are accommodated to be able totransmit or receive light, so these chambers require alight-transmissible zone or a transparent cap. On the other hand, whenit is not required to transmit or receive light in a chamber, it is notnecessary for this chamber to be light-transmissible. For example, it isnot necessary for the chamber wherein an accelerator is accommodated tobe light-transmissible, and thus a light-transmissible zone or atransparent cap is not required for this chamber. The chambers in thepresent invention can be designed according to the above-mentionedprinciples.

For the sake of simplicity, in the following FIGS. 5B-5C, the numericalreferences assigned to the first chamber A, the second chamber B, thethird chamber C, the fourth chamber D, the cap 26A and the partitioningmembers 27 a, 27 b and 27 c will not be shown. Please refer to FIGS.5B-5C in conjugation with FIG. 5A.

Please refer to FIG. 5B, which shows another embodiment of themulti-function sensor module of the present invention. Themulti-function sensor module 30 of this embodiment is similar to themulti-function sensor module 20 of the previous embodiment, but isdifferent in that: in the multi-function sensor module 30 of thisembodiment, the second chamber B and the third chamber C are filled witha filler material 29 as the multi-function sensor module 30 is packaged,such that the chips or the modules in the chambers are fully coveredwith or at least partially covered with the filler material 29, whereasthe multi-function sensor module 20 of the above-mentioned embodimentdoes not include any filler material in any chamber. The filler material29 for example can be, but not limited to, a waterproof sealingmaterial, a transparent material, or any other type of filler material.The fourth chamber D can also be filled with a filler material 29 as themulti-function sensor module 30 is packaged. This filler material 29 forexample can be, but not limited to, a waterproof sealing material, atransparent material, a transparent material incorporating melanin forlight shielding effect, or any other type of filler material. In oneembodiment, the filler material 29 filled in the second chamber B, thethird chamber C and the fourth chamber D is a same material (as shown inFIG. 5B). In another embodiment, the filler materials 29 filled in thesecond chamber B, the third chamber C and the fourth chamber D aredifferent from one another. The filler material 29 can be used to, forexample but not limited to, filter light and/or prevent unwanted dustsfrom entering into the chambers.

In the embodiment shown in FIG. 5B, preferably, a filtering material 32can be adopted to entirely or partially seal the firstlight-transmissible zone 21 a of the first chamber A. The filteringmaterial 32 can filter signals other than the infrared range, such thatthe infrared temperature sensor module 22 can receive the infraredtemperature signal more accurately, to increase the sensitivity of theinfrared temperature sensor module 22. In one embodiment, the filteringmaterial 32 for example can be, but not limited to, a transparentmaterial incorporating melanin for light shielding effect. Besides, asmentioned above, it may not be required for the fourth chamber D toinclude the fourth light-transmissible zone 21 d, and the cap 26A forexample can be made of a transparent material; or, if it is not requiredfor the device in the fourth chamber D to transmit or receive light, thefourth chamber D does not need to be light-transmissible.

Please refer to FIG. 5C in conjugation with FIG. 6C. FIG. 5C showsanother embodiment of the multi-function sensor module of the presentinvention. FIG. 6C is a simplified schematic diagram according to FIG.5C. For the sake of simplicity, only the infrared temperature sensormodule 22 is illustrated in FIG. 6C.

The multi-function sensor module 40 of this embodiment is similar to themulti-function sensor module 30 of the above-mentioned embodiment, butis different in that:

First, in the multi-function sensor module 40 of this embodiment, thefirst chamber A is filled with a protection material 41 as themulti-function sensor module 40 is packaged. In one embodiment, theprotection material 41 for example can be, but not limited to,polyethylene (PE), polypropylene/polypropene (PP), polyethyleneterephthalate (PET) or any other infrared light transmissible material.

Second, the first chamber A further includes a protection cap layer 42located above the infrared temperature sensor module 22. The protectioncap layer 42 only allows an infrared temperature signal, which forexample is generated from the object (such as the finger 15 shown inFIG. 1A), to pass through. In one embodiment, the protection cap layer42 for example is made of, but not limited to, polyethylene (PE),polypropylene/polypropene (PP), polyethylene terephthalate (PET) or anyother infrared light transmissible material. The protection material 41as well as the protection cap layer 42 can be used to, for example butnot limited to, filter light and/or prevent unwanted dusts from enteringinto the infrared temperature sensor module 22. As mentioned above, inanother embodiment, it may not be required for the fourth chamber D toinclude the fourth light-transmissible zone 21 d, and the cap 26A forexample can be made of a transparent material; or, if it is not requiredfor the device in the fourth chamber D to transmit or receive light, thefourth chamber D does not need to be light-transmissible.

Please refer to FIG. 6A. FIG. 6A shows another embodiment of themulti-function sensor module of the present invention. For the sake ofsimplicity, only the infrared temperature sensor module 22 isillustrated in FIG. 6A. Please refer to FIG. 5C in conjugation with FIG.6A.

The multi-function sensor module 40 a of this embodiment is similar tothe multi-function sensor module 40 of the above-mentioned embodiment,but is different in that: first, the first light-transmissible zone 21 ais directly sealed with a protection material 41; second, the firstchamber A in the multi-function sensor module 40 a does not include aprotection cap layer 42. Similar to the previous embodiment, theprotection material 41 can be used to, for example but not limited to,filter light and/or prevent unwanted dusts from entering into theinfrared temperature sensor module 22.

Please refer to FIG. 6B. FIG. 6B shows another embodiment of themulti-function sensor module of the present invention. For the sake ofsimplicity, only the infrared temperature sensor module 22 isillustrated in FIG. 6B. Please refer to FIG. 5C in conjugation with FIG.6B.

The multi-function sensor module 40 b of this embodiment is similar tothe multi-function sensor module 40 of the above-mentioned embodiment,but is different in that: first, the first chamber A is not filled witha protection material 41 as the multi-function sensor module 40 b ispackaged; second, only the protection cap layer 42 is provided forprotecting the infrared temperature sensor module 22. Similar to theabove-mentioned embodiments, the protection cap layer 42 can be used to,for example but not limited to, filter light and/or prevent unwanteddusts from entering into the infrared temperature sensor module 22.

Please refer to FIG. 6D. FIG. 6D shows another embodiment of themulti-function sensor module of the present invention. For the sake ofsimplicity, only the infrared temperature sensor module 22 isillustrated in FIG. 6D. Please refer to FIG. 5C in conjugation with FIG.6D.

The multi-function sensor module 40 d of this embodiment is similar tothe multi-function sensor module 40 of the above-mentioned embodiment,but is different in that: first, the first chamber A is not filled witha protection material 41 as the multi-function sensor module 40 d ispackaged; second, this embodiment does not include a protection caplayer 42. Instead, a protection ring 45 is provided at the periphery ofa space between the infrared temperature sensor module 22 and the firstlight-transmissible zone 21 a. The protection ring 45 prevents unwanteddusts from entering into the first chamber A through the periphery ofthe space between the infrared temperature sensor module 22 and thefirst light-transmissible zone 21 a. The protection ring 45 can be madeof any material, as long as such material can seal the periphery of thespace between the infrared temperature sensor module 22 and the firstlight-transmissible zone 21 a.

Please refer to FIG. 7A. FIG. 7A shows a further other embodiment of themulti-function sensor module of the present invention. In the embodimentshown in FIG. 7A, the present invention integrates “contact typetemperature sensing function” and “non-contact type temperature sensingfunction” into one single multi-function sensor module 50.

For the sake of simplicity, only the infrared temperature sensor module22 is illustrated in FIG. 7A, while the other parts are omitted.

In this embodiment, the multi-function sensor module 50 further includesa contact type temperature sensor 52 and a temperature contact point 54.In this embodiment, when a user wears the wearable assembly 33 (forexample but not limited to a watch) on his or her wrist, the temperaturecontact point 54 of the wearable assembly 33 will be facing the object16 directly (for example but not limited to the skin of the wrist).Thus, the multi-function sensor module 50 of this embodiment can sensethe temperature of the skin of the wrist by the contact type temperaturesensor 52. The temperature contact point 54 directly contacts the object16; the contact type temperature sensor 52 determines the temperatureaccording to the signal transmitted from the temperature contact point54. The temperature contact point 54 and the light-transmissible window21 (referring to FIGS. 2A-2C) are at different sides of themulti-function sensor module 50. The multi-function sensor module 50 cansense a forehead temperature in a non-contact manner through thelight-transmissible window 21 (and the first light-transmissible zone 21a)

That is, in this embodiment, the user not only can sense the skintemperature of the wrist by direct contact (which for example can beused to trace a change in a user's body temperature), but also can sensea temperature in a non-contact manner (which for example can be used tosense the temperature of other people or objects nearby), whereby thewearable device 100 with combined sensing capabilities of the presentinvention is more friendly and convenient to a user.

Besides the above, the multi-function sensor module 50 of thisembodiment also has the same advantages and features as theabove-mentioned multi-function sensor modules 20, 30 and 40, which arenot redundantly repeated here.

Please refer to FIG. 7B. FIG. 7B shows another embodiment of themulti-function sensor module of the present invention. For the sake ofsimplicity, only the infrared temperature sensor module 22 isillustrated in FIG. 7B.

The multi-function sensor module 60 of this embodiment is similar to themulti-function sensor module 50 of the above-mentioned embodiment, butis different in that: the temperature contact point 54 is coupled to theinfrared temperature sensor module 22 via a signal transmissionstructure 53. Hence, only one single infrared temperature sensor module22 is required to sense the temperature and generate the temperaturereadout.

Besides the above, the multi-function sensor module 60 of thisembodiment also has the same advantages and features as theabove-mentioned multi-function sensor modules 20, 30, 40 and 50, whichare not redundantly repeated here.

Please refer to FIG. 8 in conjugation with FIG. 9A. FIG. 8 shows a topview of a multi-function sensor module according to another embodimentof the present invention. FIG. 9A shows a cross-sectional view ofanother embodiment of the multi-function sensor module of the presentinvention.

The multi-function sensor module 70 of this embodiment is similar to themulti-function sensor module 30 of the above-mentioned embodiment, butis different in that: the infrared temperature sensor module 22 and theimage sensor module 23 shown in FIG. 5B is integrated as one singleimage sensor-infrared temperature sensor complex module 72 (as shown bythe top view of FIG. 8), so that the volume and the manufacturing costof the product are effectively reduced. The image sensor-infraredtemperature sensor complex module 72 is electrically connected to acorresponding external circuit via conduction wires 231 and 232.

Besides the above, the multi-function sensor module 70 of thisembodiment also has the same advantages and features as theabove-mentioned multi-function sensor module 30, which are notredundantly repeated here.

Please refer to FIG. 9B, which shows another embodiment of themulti-function sensor module of the present invention. Themulti-function sensor module 80 of this embodiment is similar to themulti-function sensor module 40 of the above-mentioned embodiment, butis different in that: the infrared temperature sensor module 22 and theimage sensor module 23 shown in FIG. 5C is integrated as one singleimage sensor-infrared temperature sensor complex module 82 (as shown bythe top view of FIG. 8), so that the volume and the manufacturing costof the product are effectively reduced.

Besides the above, the multi-function sensor module 80 of thisembodiment also has the same advantages and features as theabove-mentioned multi-function sensor module 40, which are notredundantly repeated here.

Please refer to FIG. 9C, which shows a further other embodiment of themulti-function sensor module of the present invention. Themulti-function sensor module 90 of this embodiment is similar to themulti-function sensor module 80 of the above-mentioned embodiment, butis different in that: as compared to the image sensor-infraredtemperature sensor complex module 82 shown in FIG. 9C, which employs apartitioning member 27 c to separate the first chamber A and the secondchamber B, the multi-function sensor module 90 of this embodiment mergesthe first chamber A and the second chamber B to become one singlechamber, so there is no longer a partitioning member 27 c in themulti-function sensor module 90. In the embodiment shown in FIG. 9C, thechamber wherein the image sensor-infrared temperature sensor complexmodule 82 is accommodated can be filled with the above-mentioned fillermaterial 29 as the multi-function sensor module 90 is packaged.

The present invention has been described in considerable detail withreference to certain preferred embodiments thereof. It should beunderstood that the description is for illustrative purpose, not forlimiting the scope of the present invention. An embodiment or a claim ofthe present invention does not need to achieve all the objectives oradvantages of the present invention. The title and abstract are providedfor assisting searches but not for limiting the scope of the presentinvention. Those skilled in this art can readily conceive variations andmodifications within the spirit of the present invention. In view of theforegoing, the spirit of the present invention should cover all such andother modifications and variations, which should be interpreted to fallwithin the scope of the following claims and their equivalents.

1. A wearable device with combined sensing capabilities, comprising: awearable assembly for being worn on a part of a user's body, wherein thewearable assembly has at least two light-transmissible windows, one ofthe at least two light-transmissible windows is provided at an uppersurface of the wearable assembly, and another one of the at least twolight-transmissible windows is provided at a lower surface of thewearable assembly; and at least two multi-function sensor moduleslocated inside the wearable assembly, wherein, the at least twomulti-function sensor modules are respectively corresponding to the twolight-transmissible windows, wherein, the at least two multi-functionsensor modules are for performing an image sensing function and aninfrared temperature sensing function, wherein, the multi-functionsensor module corresponding to the light-transmissible window providedat the upper surface performs non-contact type temperature sensing, andwherein the multi-function sensor module corresponding to thelight-transmissible window provided at the lower surface performscontact type temperature sensing; whereby, the wearable deviceintegrates both non-contact type temperature sensing and contact typetemperature sensing into the one single wearable assembly.
 2. Thewearable device with combined sensing capabilities of claim 1, whereinthe image sensor module includes a light source and an image sensor, thecap covering a part of the substrate and the at least one partitioningmember being on the substrate, to form at least three chambers foraccommodating the light source, the image sensor and the infraredtemperature sensor module, respectively, wherein each of the at leastthree chambers has a light-transmissible zone, and a light beam isallowed to transmit between the light-transmissible zone and thelight-transmissible window of the wearable assembly.
 3. The wearabledevice with combined sensing capabilities of claim 1, wherein the imagesensor module includes a light source and an image sensor, the imagesensor and the infrared temperature sensor module being integrated asone single module.
 4. The wearable device with combined sensingcapabilities of claim 3, wherein the at least one multi-function sensormodule further includes a substrate, a cap and at least one partitioningmember, the cap covering a part of the substrate and the at least onepartitioning member being on the substrate, to form at least twochambers for accommodating the light source and the single module,respectively, wherein each of the at least two chambers has alight-transmissible zone, and a light beam is allowed to transmitbetween the light-transmissible zone and the light-transmissible windowof the wearable assembly.
 5. The wearable device with combined sensingcapabilities of claim 2, wherein the light source, the image sensor andthe infrared temperature sensor module are not covered with a fillermaterial.
 6. The wearable device with combined sensing capabilities ofclaim 3, wherein the light source, the image sensor and the infraredtemperature sensor module are not covered with a filler material.
 7. Thewearable device with combined sensing capabilities of claim 2, whereineach of the light source and the image sensor is fully covered with orat least partially covered with a corresponding filler material, whilethe infrared temperature sensor module is not covered with a fillermaterial.
 8. The wearable device with combined sensing capabilities ofclaim 3, wherein each of the light source and the image sensor is fullycovered with or at least partially covered with a corresponding fillermaterial, while the infrared temperature sensor module is not coveredwith a filler material.
 9. The wearable device with combined sensingcapabilities of claim 2, wherein each of the light source, the imagesensor and the infrared temperature sensor module is fully covered withor at least partially covered with a corresponding filler material. 10.The wearable device with combined sensing capabilities of claim 3,wherein each of the light source, the image sensor and the infraredtemperature sensor module is fully covered with or at least partiallycovered with a corresponding filler material.
 11. The wearable devicewith combined sensing capabilities of claim 1, wherein thelight-transmissible zone corresponding to the infrared temperaturesensor module is sealed entirely or partially with a light filteringmaterial.
 12. The wearable device with combined sensing capabilities ofclaim 2, wherein the light-transmissible zone corresponding to theinfrared temperature sensor module is sealed entirely or partially witha light filtering material.
 13. The wearable device with combinedsensing capabilities of claim 1, wherein a protection cap layer isconnected above the infrared temperature sensor module, wherein a spacebetween the protection cap layer and the infrared temperature sensormodule is not filled with any filler material.
 14. The wearable devicewith combined sensing capabilities of claim 2, wherein a protection caplayer is connected above the infrared temperature sensor module, whereina space between the protection cap layer and the infrared temperaturesensor module is not filled with any filler material.
 15. The wearabledevice with combined sensing capabilities of claim 1, further comprisinga protection ring between the infrared temperature sensor module and thelight-transmissible zone corresponding to the infrared temperaturesensor module, the protection ring surrounding a lateral periphery of aspace between the infrared temperature sensor module and thecorresponding light-transmissible zone.
 16. The wearable device withcombined sensing capabilities of claim 2, further comprising aprotection ring between the infrared temperature sensor module and thelight-transmissible zone corresponding to the infrared temperaturesensor module, the protection ring surrounding a lateral periphery of aspace between the infrared temperature sensor module and thecorresponding light-transmissible zone.
 17. The wearable device withcombined sensing capabilities of claim 1, wherein the at least onemulti-function sensor module further includes a MicroelectromechanicalSystems (MEMS) device for providing one of the following functions: asweat sensor, an ultraviolet light sensor, a gas sensor, anaccelerometer, a gyroscope, an altimeter or a pedometer. 18-20.(canceled)
 21. The wearable device with combined sensing capabilities ofclaim 1, wherein each of the at least two multi-function sensor moduleincludes: an image sensor module for sensing a physical or a biologicalfeature of an object through the at least one light-transmissible windowby way of image sensing; and an infrared temperature sensor module forsensing temperature through the corresponding light-transmissible windowby way of infrared temperature sensing.